Amkor (AMKR) names Taiwan leader with semiconductor packaging background

March 15, 2012 — Semiconductor assembly and test services (SATS) provider Amkor Technology Inc. (Nasdaq:AMKR) added Mike Liang as president of Amkor Technology Taiwan. Liang’s background includes stints with Phoenix Semiconductor, Ti-Acer, UMC, and others.

Liang and his team will serve packaging and test customers and execute Amkor’s strategies in Taiwan. Taiwan recently took the global lead in wafer fabrication capacity, beating out its Asian neighbors and the Americas. Taiwan also leads in 300mm wafer capacity installed.

Liang brings "a proven track record in operations, sales and marketing for semiconductor packaging, wafer processing and testing services," said JooHo Kim, Amkor EVP, worldwide manufacturing operations. Liang was most recently president and CEO of King Yuan Electronics Corporation in Hsin-Chu, Taiwan, and has held executive and operational roles at Phoenix Semiconductor International, AbelLink Technology, Mosel-Vitelix, Ti-Acer, and United Microelectronics Corporation (UMC). Liang holds a Bachelor of Science in physics from National Cheng Kung University and an MBA from National Taiwan University.

Amkor provides semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information on Amkor


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