Amkor licenses 3D packaging tech to SHINKO

March 30, 2012 – BUSINESS WIRE — Semiconductor packaging and test services (SATS) provider Amkor Technology Inc. (NASDAQ:AMKR) granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo:6967) a non-exclusive license to its proprietary Through Mold Via (TMV) semiconductor packaging technology.

Amkor will transfer its TMV process to SHINKO, which can manufacture packages based on the via technology under Amkor’s patents. SHINKO may also use the registered TMV trademark for sales and marketing activities. Amkor customers will have multiple sources for the TMV packaging service. Last year, Amkor surpassed 100 million units of its TMV products fabricated.

The technology provides SHINKO with a 3D package stacking process for package on package (PoP) components. With TMV, a blind via is created through the mold compound after package molding. This exposes PoP bond pads on the package substrate

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