Henkel underfill boasts high Tg for WLCSP and PoP devices

March 6, 2012 — Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.

LOCTITE UF3810 is formulated to be halogen-free, reworkable, and demonstrate a glass transition temperature (Tg) of 100


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