March 19, 2012 – BUSINESS WIRE — Wafering tool supplier Silicon Genesis (SiGen) developed its second-generation production system for fabricating thin-silicon solar wafers, as well as high-brightness light-emitting diode (HB-LED), and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.

The new GenII PolyMax system targets high volumes, aiming to replace wire wafer saws with a kerf-free wafering tool. The system creates thinner wafers than are possible with wire-based slicing. The proton beam-induced wafering design was created over 6 years with numerous equipment and solar cell partners.

SiGen has made free-standing 20um, 50um, 85um, 120um, and 150um of 125mm and 156mm industry standard square kerf-free monocrystalline silicon solar-cell wafers.

SiGen’s beam-induced wafering technology is capable of supplying thin high-quality materials to HB-LED and packaging/3D structures sectors, at a lower price point than competitive technologies, and with less waste, the company reports.

Silicon Genesis Corporation (SiGen) provides engineered substrate process technology for the semiconductor, display, optoelectronics, and solar markets. For more information on Silicon Genesis, visit http://www.sigen.com.

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