March 29, 2012 – Marketwire — ODIS Inc., a company of OPEL Technologies Inc. (TSXVENTURE:OPL), has developed an optical interface chip that is the first step in achieving a single device capable of interconnecting multiple processors by waveguide and/or fiber to transport ultra-high speed signals.
ODIS’s optical interface chip will integrate a Laser, Optical Modulator, Modulator Driver, Detector, Receiver Amplifiers, SerDes, CDR and PLL circuits monolithically on a single chip. The device is built on III-V gallium arsenide (GaAs) semiconductor technology.
This advancement simplifies chip packaging while the optical interface chip bandwidth supports the very large data rates (>100Gb/s) for CMOS processor interconnect without the additional power otherwise required with conventional electrical I/O.
The semiconductor POET process enables the monolithic fabrication of integrated circuits containing both electronic and optical elements, with potential high-speed and power-efficient applications in devices such as servers, tablet computers and smartphones. ODIS’ achievement will be added to the POET platform under development, making it possible to implement an optical interface as a single chip to connect existing CMOS processors.
The new POET roadmap will outline the process for speed-to-market devices, capital requirements and monetization opportunities in the commercial and defense technology markets.
ODIS Inc., a U.S. company of OPEL Technologies Inc., designs III-V semiconductor devices for military, industrial and commercial applications, including infrared sensor arrays and ultra-low-power random access memory. OPEL’s common shares trade on the TSX Venture Exchange under the symbol OPL. For more information, visit www.odisinc.com.