April 30, 2012 – Marketwire — A leading semiconductor manufacturer placed a follow-on order with Mattson Technology Inc. (NASDAQ:MTSN), wafer fab equipment supplier, for a Millios millisecond annealing system (MSA).
The chip maker will use the Millios MSA in volume production of advanced logic devices. The follow-on order comes as the chipmaker moves from pilot to high-volume manufacturing.
Rapid thermal annealing can minimize current leakage from IC transistors, enabling lower power consumption in mobile devices, said Pete Lembesis, MSA business leader of Mattson Technology’s Thermal Products Group. MSA can deliver short time scales, in the millisecond range, to meet current leakage requirements, he added. The Millios MSA forms ultra-shallow junctions, processes advanced silicides, and more, with a temperature range of 250°-1350°C. Millios features a direct temperature measurement and control throughout the ms-anneal cycle.
Mattson has installed Millios with 3 customers.
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment, including plasma and rapid thermal processing equipment for dry strip, rapid thermal processing and etch. Internet: www.mattson.com.