MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel

April 5, 2012 — MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND. It comes in an 18 x 14mm, 100-ball BGA package.

The 16 industry-standard 32Gb NAND Flash die are stacked with two HLNAND interface devices, outputting 333MB/s (DDR333) at 1.8V output over 1 byte-wide HLNAND interface channel.

HLNAND is fabricated with a ring architecture, which avoids performance degradation in large chip stacks, compared to parallel bus architectures, said Jin-Ki Kim, VP of R&D, MOSAID. The ring architecture allows virtually unlimited NAND die to be connected on a single channel. It does not require termination resistors, lowering the device

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.