April 5, 2012 — Interconnect materials supplier Engineered Conductive Materials LLC uncrated a low-temperature curing conductive adhesive, DB-1541-LTC, for organic light emitting diode (OLED) and organic photovoltaics (OPV) manufacturing.
The material is formulated for conductivity and stability on various substrates when cured at 100°C or higher (Cure time of 1min @ 180°C or slower at lower temperatures). Its dispensing work life exceeds 48 hours (25% increase in viscosity).
The product resists damp heat and boasts conductivity stability on tin, tin-silver and silver-plated ribbons. It cures to a rubber-like flexibility with high peel strength, withstanding stresses induced in reel-to-reel (R2R) manufacturing processes and flexible end-use applications.
Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. Web site: www.conductives.com.