Terepac builds miniaturized embedded circuits with wireless connectivity

April 2, 2012 – PRNewswire — Terepac Corporation, developer of tiny digital electronics, has launched the TereTag miniaturized circuit design that is embedded in items to enable the "Internet of Things."

This tag enables the host object to identify, communicate, and operate with more security and efficiency, interacting with a cell phone for sharing via Twitter, Facebook and Google. The user can access details about the product and share information with friends through social networks, for example.

The design is a combination of miniaturizing electronics, and enabling networking with external electronic devices, said Terepac CEO Ric Asselstine. Terepac’s patent-protected process reportedly creates "unprecedented" miniaturized electronics. The company is producing apps and networking capability and data collection technologies to enable the object to become an app platform, mining, managing, and visualizing data, and sharing via social media.

The low-power, low-cost connectivity of the devices could enable new applications in environmental monitoring, branding, etc. "Every thing today has the potential to be transformed into a smart object," said Asselstine.

Also read: Terepac expands to Silicon Valley

Terepac Corporation has developed a breakthrough semiconductor packaging and assembly method to allow effective handling and packaging of the tiniest imaginable chips, objects and electronic components – at its limit to the nanometer scale. Sophisticated microelectronics can be printed on flexible substrates at a fraction of the size and cost of conventional methods. Entire structures with microprocessors, memory and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil with no sacrifice in performance. For more information, visit www.terepac.com.

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