April 17, 2012 — Brewer Science Inc. released new wafer processing equipment for thin wafer separation and post-debond cleaning during compound semiconductor (CS) device processing: a thermal debonder, separation tool, and megasonic cleaning system.
Cee 1300CSX is a semi-automatic thermal debonder for high-temperature slide-off debonding of thinned III-V and CS materials (GaAs, GaN, InP, and SiC) in a laboratory setting.
The ZoneBOND low-stress, room-temperature debonding separation tool has compliant seal clamps and fail-safe abort hardware to accommodate thinned III-V and CS materials. Higher precision in this generation of the tool targets highly mechanically and thermally sensitive debonding materials. It handles wafers from 2” to 12”.
Cee 300MXD megasonic cleaning system applies uniform acoustic energy to spinning substrates, gently removing adhesive residues and contaminants without damaging fragile device structures.
The Cee lab-scale processing tools suit low-volume prototype processing that can be transferred to high-volume manufacturing, said Wayne Farrar, director of equipment at Brewer Science.
Visit Brewer Science at CS MANTECH, booth 47, April 23-26 in Boston, MA.
Brewer Science provides specialty materials, equipment, and process solutions for applications in semiconductors, compound semiconductors, advanced packaging/3D ICs, MEMS, sensors, displays, LEDs, and printed electronics. Learn more: http://www.brewerscience.com.