April 9, 2012 — TSMC (TWSE: 2330, NYSE:TSM) began Phase 5 of its Fab 14 GigaFab at the South Taiwan Science Park in Tainan, planned to be a “key production center” for advanced 20nm semiconductor chips. The company held a groundbreaking ceremony for Phase 5, hosted by chairman and CEO Dr. Morris Chang.
TSMC’s Fab 12 Phase 6 in Hsinchu, Taiwan is also producing 20nm leading-edge devices. 20nm technology is scheduled to begin volume production at Fab 12 next year, and Fab 14 will begin in early 2014. Fab 14 will also undergo Phase 6 development, bringing total cleanroom area to 87,000sq.m.
Fab 14 is TSMC’s second 12” fab (Fab 12 is its first). Phase 1 of the facility began volume production in 2004. Phases 1-4 are now in operation, producing 550,000 12” wafers per quarter, for estimated annual revenue of US$6 billion. TSMC expects the combined annual revenue of Phases 5 and 6 to reach a similar scale. Fab 14 currently employs approximately 4600 workers, adding another 4500 in the expansion.
Fab 14 Phase 5 will also apply for “gold-level” US Leadership in Energy and Environmental Design (LEED) green building certification. Fab 14 Phases 3 and 4 are both certified.
Taiwan Semiconductor Manufacturing Company (TSMC) is a leading semiconductor foundry. Learn more at www.tsmc.com.