CMP carrier upgrades legacy fab tools

May 23, 2012 — CMP and wafer thinning equipment supplier Axus Technology introduced the Titan Carrier Upgrade for IPEC and Strasbaugh legacy chemical mechanical polishing/planarization (CMP) tools for semiconductor and related manufacturing.

The upgrade reportedly improves uniformity, throughput, and yield on IPEC 372M and 472 systems and Strasbaugh 6DS-SP and 6EC platforms. The upgrade installs without affecting the tool software, host control, or recipe management. It builds on the process and production history of several thousand Applied Materials Titan carriers in production use on Mirra tools.

Titan processing on IPEC 472 and Strasbaugh 6DS-SP platforms demonstrates improved edge exclusion, out to 3mm, and up to 5x higher uniformity than standard fixed-ring carriers. Removal rates are 30-100% faster. Typical oxide baseline results with the Titan upgrade are 3% or less.

The Titan carrier upgrade is membrane-based, eliminating the vacuum holes that are required on metal plate carriers. The sealed membrane prevents uptake of process fluids, helping ward off corrosion and semiconductor wafer defects, as well as reducing maintenance requirements for the CMP system’ rotary unions and valves.

Watch a video about the Titan upgrade at

Axus Technology provides surface processing solutions for a range of semiconductor, MEMS, substrate, and related technologies. For more information, visit

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