How to cope with semiconductor fab tool obsolescence: ConFab preview

May 31, 2012 — Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.

The ConFab is an invitation-only event for the semiconductor industry, June 3-6 in Las Vegas. Rajguru will join John Frank, SVP Industrial and Advanced Technology, CH2MHill; Gary Robertson, division GM, KLA-Tencor; and Mike Barrow, EVP and COO, International Rectifier, in the session.

Moore’s Law dictates that some portion of our semiconductor product base becomes obsolete every year, Rajguru points out. A growing list of 200mm manufacturing parts also becomes obsolete every year. Tool obsolescence is possibly the most critical problem faced by legacy manufacturers.

To help identify the root cause and possible solutions to obsolescence, ISMI conducted over a year’s research. Rajguru will cover tactical and strategic methods that semiconductor manufactures in the mature production sector can use for dealing with tool obsolescence.

Sanjay Rajguru is the director of International SEMATECH Manufacturing Initiative (ISMI), responsible for the consortium’s manufacturing technology programs. His role includes leading ISMI’s Manufacturing Capabilities and Mature Fabs programs, which are focused on the systematic improvement of manufacturability: factory and equipment stability, productivity and cost improvements, and equipment lifecycle management. He also oversees the ISMI ESH Technology Center, a global collaborative research organization including chip manufacturers and equipment and material suppliers devoted to collectively finding and implementing the most cost-effective, environmentally friendly manufacturing processes and procedures. Prior to joining ISMI, Rajguru was a fab manager at National Semiconductor for 13 years and held various engineering and management positions with Nortel Semiconductors.

Other ConFab previews:

Bridging the fabless-foundry gap

EUV lithography readiness

Packaging progress

Emerging growth sectors

Visit the Semiconductors Channel of Solid State Technology!


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.