Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Though-silicon vias (TSVs) are moving into volume packaging production, as manufacturers work to solve challenges with reliability, cost and scaling. 2.5D, where interposers of silicon or glass are used, is seen as an intermediary step before full-blown 3D. This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.