ConFab interview: G450 Consortium’s Tom Jefferson on 450mm timeline

June 6, 2012 — Tom Jefferson, G450 Consortium, shares an update on 450mm wafers for semiconductor manufacturing. The consortium is adding staff and ramping its silicon supply, and getting ready for equipment selection. Jefferson speaks with Solid State Technology editor-in-chief Pete Singer at The ConFab 2012, an invitation-only meeting of the semiconductor industry.


The consortium is installing some early metrology tools for 450mm now, with the majority of equipment coming in during 2013, and some trailing installs in 2014. Jefferson expects to fill the 25,000sq.ft. available at Albany – State University of New York (SUNY) – College of Nanoscale Science and Engineering’s (CNSE) with tools for 450mm.

When will 450mm be used in pilot lines? That’s a question for each chipmaker to answer, Jefferson said.

More from The ConFab 2012:

Bill Tobey on EUV lithography

3D and 2.5D semiconductor packaging technologies @ The ConFab

Supply chain or supply web for 3D packaging?

Chasing price, power and performance

Semiconductors in the smart society: Next-generation connectivity

Turning the technology knobs for system scaling

How to prevail over silicon cycles

Semiconductor industry experts look to the future

A virtual IDM concept

Managing legacy fabs and supply obsolescence

Visit the Semiconductors Channel of Solid State Technology!


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