Dow Corning teams with SUSS on TSV bonding process

June 25, 2012 – BUSINESS WIRE — Materials supplier Dow Corning will collaborate with semiconductor processing tool supplier SUSS MicroTec on a temporary bonding process (materials and equipment) for through-silicon vias (TSV) in high-volume advanced semiconductor packaging.

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process. Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods and provides compatibility with thermal and chemical requirements for via-middle and interposer TSV processing, as well as faster room-temperature de-bonding required for advanced packaging applications.

Also read: Imec’s via-middle TSV fab ‘reveals’

Dow Corning provides performance-enhancing silicones and silicon-based technology and innovation. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. Learn more at

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