June 18, 2012 — H-Square Corp introduced its 450mm Ergolift for handling new 450mm semiconductor wafer front opening shipping boxes/multi-application carriers (FOSB/MACs), which can weigh more than 60lbs.
With 450mm still under development, OEMs and tool developers do not have automated systems in place to transport 450mm FOSB/MACs. The 450mm Ergolift uses a battery-powered end effector to lift and lower the FOSB/MACs by their robotic flange, easing loading/unloading. Removable safety pins keep carriers from sliding on end effector during transportation.
Ergolifts can be custom fitted to mate with a variety of equipment front-end modules (EFEMs), load ports and storage areas.
H-Square Corporation specializes in providing high quality, wafer and substrate fabrication handling tools and equipment to the Semiconductor, MEMS, LED, Flat Panel Display, Storage Media, Biotech, Photolithography and Solar Industries. Learn more at www.h-square.com.