New speaker added for 3D and 2.5D Integration webcast

June 25, 2012 — Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International. The webcast is sponsored by EV Group (EVG) and ALLVIA.

3D and 2.5D Integration: A Status Report will cover through-silicon via (TSV) formation, interposers, and other die stacking methods. What is the present status of these advanced packaging technologies?

Now, William Chen, senior technical advisor, Advanced Semiconductor Engineering Inc. (ASE US Inc.), had been added to the speaker list for this webcast. ASE is a leading semiconductor assembly and test services (SATS) provider, headquartered in Taiwan. William Chen recently spoke at The ConFab 2012, where he discussed the rise of

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