OLED thin-film encapsulation technology key to new applications

June 29, 2012 — OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies such as VITEX, 3M, GE, UDC, Samsung, LG, Philips, and DuPont will increase accordingly, shows Displaybank’s report, “OLED Thin Film Encapsulation Technology Key Patent Analysis.”

Figure. OLED Thin Film Encapsulation Patent Application Trends. SOURCE: Displaybank.

Encapsulation protects organic light emitting diodes (OLEDs) from the external environment. Methods include CAN, glass, thin film, and hybrid encapsulation technology. Of these, thin film encapsulation is expected to be the enabling factor for lightweight and thin large-area OLED as well as flexible OLED. These architectures will support next-generation displays and OLED lighting.

OLED thin-film encapsulation patents are growing in line with increasing interest in flexible OLED and OLED lighting technology and the acceleration of technology development competition.

The report examines worldwide patent application trends, particularly from Korea, Japan, the US, and Europe. In addition, in-depth analysis such as key patent status of major companies, technology development, citation relation analysis, key patent point analysis, and key patent example analysis were performed by extracting 135 key patents around U.S. patents. Access the report at http://www.displaybank.com/_eng/research/report_view.html?id=875&cate=1

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