Silicon chip-on-board LED substrate enables best thermal dissipation

June 18, 2012 – PRWEB — Daewon Innost achieved what it says is the light-emitting diode (LED) industry’s best thermal dissipation performance on its Glaxum LED Array family of chip on board (COB) modules. The proprietary Nano-Pore Silicon Substrate (NPSS) technology developed by Daewon Innost led to thermal impedance of 0.41°C/W.

Daewon Innost’s NPSS is created by applying semiconductor lithography to silicon wafers, allowing for 50µm-pitch interconnection between gallium nitride (GaN) LED chips; conventional metal-core printed circuit boards (MCPCBs) cannot drop below 300µm pitches. The COB modules are fabricated with high-efficacy, commercially available 1W LED chips. An LED chip supplier independently tested the modules.

“Our Glaxum module runs over 12°C cooler than the previous top performing COB module,” said Sungyuk ‘Stephen’ Won, CEO of Daewon Innost, noting that generally 1°C lower operating temperature = an extra 1000 hours of lifetime.

The Glaxum NPSS modules are available in models ranging from 3.5 to 100W. The models with lowest thermal impedance are Glaxum-MCL-GL-WC-020-002 (warm white) and the Glaxum-MCL-GL-CC-020-002 (cool white). Tested voltage and current value of Glaxum module is 16.6 V, 1.2 A, respectively.

Daewon Innost was founded in 2011 as a spin-off from Daewon SPIC, a leading company in the global semiconductor packaging industry, to focus on LED lighting. Learn more at

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