STATS ChipPAC ships 1 billionth package using copper wire bonds

June 18, 2012 – Marketwire — Semiconductor packaging and test services provider STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped. STATS ChipPAC offers high-volume semiconductor assembly and dedicated engineering expertise to developing a copper wire bonding process to suit advanced, multi-die laminate and leaded packages including 3D packaging.

STATS ChipPAC

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