Ultratech acquires IBM patents for semiconductor packaging processes

June 29, 2012 – BUSINESS WIRE — Semiconductor fab tool supplier Ultratech Inc. (Nasdaq:UTEK) acquired the rights to a collection of patents from semiconductor leader IBM. Ultratech gained semiconductor packaging technologies including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging IP.

Representing both U.S. and foreign patents, the portfolio includes claims directed at methods of making, at compositions and at structures of semiconductor devices. This acquisition strengthens and broadens Ultratech’s offerings to facilitate advanced packaging at the lower device nodes.

Ultratech, Inc. (Nasdaq: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Visit Ultratech online at: www.ultratech.com.

IBM makes semiconductors and other microelectronics. For more information on IBM, please visit:www.ibm.com

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.