USI process produces copper-filled vias on ceramic substrates

June 12, 2012 – BUSINESS WIRE — UltraSource Inc., thin film circuits and ceramic interconnect device supplier, announced CopperVia, a process that fills vias with pure copper to yield low-cost, high-conductivity, reliable electrical and thermal interconnects in ceramic thin film circuit substrates.

The CopperVia process is based on the existing patented UltraVia process. CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability. It can be used in planar, 2.5D, 3D, and multilayer thin film circuitry.

Solid filled vias provides a low inductance, microwave grounding path, allowing high performance RF circuits to be assembled in a thermally efficient surface mount configuration.

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