July 11, 2012 — Barclays Capital analysts share observations from meetings with semiconductor manufacturing tool suppliers at SEMICON West, noting the enthusiasm and concrete deals around extreme ultraviolet (EUV) lithography and transitioning to the 450mm wafer size.

The focus for the long-term industry outlook was on EUVL and 450mm, with Intel clearly all about 450mm and everyone else in the industry intent on making EUV litho work, Barclays reports.

The R&D funds to be given to ASML for EUV development will not accelerate the roadmap between now and 2015, which points to more focus on the next generation of tools. ASML remains in the catbird seat in terms of the key drivers behind staying on Moore’s Law: EUV lithography and 450mm wafers. Also read: The Elephant Has Left the Room — 450 mm is a Go! by blogger Dick James, Chipworks.

Barclays also noted that Cymer’s (CYMI) leadership in the lithography light source sector is becoming increasingly more entrenched.

Read Barclay’s full Day 1, SEMICON West, report at http://live.barcap.com/PRC/servlets/dv.search?contentPubID=FC1837768&bcllink=decode

Check out Solid State Technology’s coverage of SEMICON West 2012!