July 6, 2012 – BUSINESS WIRE — Vantage Technology formally qualified its SlurryScope System for analysis of undiluted slurry used during chemical mechanical polishing (CMP) at major IC production fabs. The SlurryScope System commenced field testing at major wafer fab facilities in late 2010.
Conventionally, CMP slurry is diluted before analysis of particulate compositions. Vantage’s CMP metrology tool orchestrates patented laser particle-sensing techniques, powerful algorithms and multicore image processing to analyze production strength slurry with real-time measurements. The SlurryScope System instantly detects and profiles oversized particles in the 1.0-12.0µm range that can cause damaging micro-scratches to wafers. SlurryScope Systems can be installed at various points in the line to manage undiluted slurry delivery.
Mega Fluid Systems recently embedded the Vantage SlurryScope CMP metrology tool in its next-generation Slurry Delivery System (SDS). A tool has shipped to a major IC fab. Mega Fluid Systems is a leading supplier of world class chemical and slurry delivery equipment. For more information visit www.megafluidsystems.com.
Vantage will be demonstrating its metrology tool from two booths at Semicon West, July 10-12 in San Francisco. Attendees can view Vantage’s SlurryScope System at the Malema Sensors booth 625 or at the Levitronix booth 1440. Vantage executives will be on hand at both booths to interact with attendees. Vantage Technology Corporation is focused on developing real-time micro-analytical metrology tools using advanced laser technology, proprietary algorithms and multicore image processing techniques, the company has targeted its first product at the semiconductor industry. For more information, visit www.VantageTechCorp.com.