STATS ChipPAC ramps advanced flip chips to HVM, adds TCB processing capability

July 9, 2012 — STATS ChipPAC Ltd. (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, brought its fcCuBE advanced flip chip semiconductor packaging technology with copper column bumps, bond-on-lead (BOL) interconnection, and enhanced assembly processes into high-volume manufacturing (HVM) for multiple customers. STATS ChipPAC expanded its assembly processing capabilities to address a wider spectrum of bump pitch ranges from >200

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