ASE tests NCKU lower-cost packaging solder as better than SAC

August 9, 2012 – BUSINESS WIRE — Researchers at National Cheng Kung University (NCKU) in southern Taiwan developed a tin/zinc/silver/aluminum/gallium (SnZnAgAlGa) solder alloy for semiconductor packaging, and are now looking for commercialization opportunities.

The solder offers reliability and cost improvements over current interconnect materials, according to Lin Kwang-lung, professor of materials science and engineering at NCKU. Industry partners are looking into turning the alloy into solder balls, so far creating solder balls with 0.76mm, 0.50mm, and 0.30mm diameters. The material


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