The FlexTech Alliance announced the Call for Papers is open for the 12th annual Flexible Electronics & Displays Conference & Exhibition. The 3 day multi-track Flex Conference consists of in-depth technical and business development presentations covering the entire flexible electronics supply chain. Taking place January 29 – February 1, 2013 in Phoenix, Arizona, the event also includes interactive exhibits and product demonstrations, a short course series, academic research, poster sessions and a variety of networking opportunities. The deadline for submission is September 22, 2012.
The Flexible Electronics & Displays Conference & Exhibition attracts attendees from more than 10 countries and 200 companies, universities, R&D labs, and government agencies representing the many different segments of the flexible electronics and displays value and supply chains. Attendees span the roles of research, marketing, product development, manufacturing, senior business development, and executive functions.
The conference is a culmination of shared information, highlighting technical breakthroughs and demonstrating working products in flexible, printed electronics and displays. In addition to product demos and new applications, priority for paper selection will be given to original research and new toolset, process and materials introductions.
Topic areas sought are:
Business Strategies and Market Overviews for Flexible, Printed Electronics and Displays: Business Development; Road Mapping; Challenges to Early Adoption; and Customer Perspectives.
Flexible Electronics-Based Applications and Products: Flexible Displays; E-Book and Mobile Devices; Solar/Photovoltaics; Solid State Lighting and OLEDs; Energy Storage/Batteries; Smart Sensor Systems/RFID (biomedical, smart bandages, health monitors, smart clothing, neuro prosthetic devices, packaging, advertising/point of sales, pharmaceuticals, toys and entertainment, food monitoring, agricultural sensing, security, and structural monitoring).
Flexible Electronic Devices: Thin Film Transistors; Sensors and Detectors; Memory; Logic; Membranes; Device Design, Design Rules, Process Integration
Flexible Electronics Processes and Manufacturing: Additive Printing Processes (inkjet, gravure, flex, screen printing and other patterned deposition, print/ink optimization); Roll to Roll/Web Processing; Production Cost Reduction; Deposition Techniques and Equipment; Metrology; Flexible Electronics Production vs. Graphics Printing Production; Hybrid Manufacturing, Packaging, and Assembly; and Integration of printed electronics and microelectronics.
Flexible Electronics Materials: Substrates; Substrate Treatment to Optimize Films (conductors, insulators, semiconductors, light emitting; Functional Inks; Nanomaterials; Adhesives; Encapsulants; ITO Replacement; and Sustainable Materials.
Supply Chain Development
The conference, now in its 12th year, is moving to the Phoenix, Arizona Convention Center to accommodate its continuous growth. The new venue will provide technologically advanced amenities in a vibrant downtown location, while maintaining the superb networking atmosphere that has long characterized the Flex Conference. With the expanded exhibit space, attendees will be able to engage with more suppliers, customers and partners in flexible, printed electronics R&D, design and manufacturing.
For more information or to download the Call for Papers for the 2013 Flex Conference, visit www.flexconference.org. Online submissions are now available.