See 3mil wire bonding at IMAPS with Hesse & Knipps

August 16, 2012 — Wedge and wire bonder company Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will demo a new 3mil wire bonding capability on its BJ935 automatic heavy wire bonder for back-end semiconductor packaging at the 45th International Symposium on Microelectronics (IMAPS).

Packaging professionals can watch the wire bonding tool in action at IMAPS booth 210, September 9-13 in San Diego, CA.

Hesse & Knipps enhanced the capabilities of its BJ935 heavy wire bonder to process gold, aluminum and copper semiconductor die bonding wire with diameters from 3 to 20mil (75 to 500


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