Nanium ships 200 millionth eWLB component

October 10, 2012 – Nanium says it has shipped its 200 millionth embedded wafer-level ball grid array technology (eWLB) component, a milestone reached in less than two years. The achievement represents a 10% year-over-year productivity increase, and reflects full conversion to the company’s eWLB overmold technology that allows both thinner and more robust packages, according to the company.

The shipment milestone "demonstrates that eWLB technology is a robust low-cost solution delivering both high reliability and high yields for manufacturing advanced electronic products with high I/O density in a small form-factor," stated Armando Tavares, president of NANIUM

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