Many of the world’s 3D IC elite met last week at the 2nd annual Georgia Tech 2.5D Interposer Conference which focused on the technology and performance of silicon and glass interposers.
Matt Nowak of Qualcomm, long a 3D advocate, reported that Qualcomm has now built "thousands of parts" and does not see anything stopping high-volume manufacturing (HVM) except cost. Nowak indicates that Qualcomm will require a price of ~ $2 for a 200mm2 silicon interposer. The former is just out of the reach of those proposing "coarse" interposer fabrication, and the latter is significantly out of the pricing structure for dual damascene foundry-based fine interposers
Nagesh Vordharalli of Altera quoted an IMEC study which shows that the sweet spot for maximum bandwidth will come from interposers with RDL lines/spaces ~ 3