September 26, 2012 – EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.

"The compound semiconductor market has always been a front runner in driving the introduction of new temporary bonding/debonding technologies, starting from solvent-assisted debonding, tape debonding, slide off debonding and now ZoneBOND," noted Dr. Thorsten Matthias, business development director for EVG. The company has provided other equipment into compound semiconductor manufacturers for over 10 years, he noted, and introducing ZoneBOND "is a natural evolutionary step" in standardizing processes and equipment and widening options for bonding during thin-wafer processing.

EV Group and Brewer Science codeveloped the ZoneBOND technology, which works with silicon, glass, and other carriers and existing adhesive platforms. Debonding can take place at room temperature with virtually no vertical force on the device wafer. ZoneBOND defines two carrier wafer zones, with strong perimeter adhesion and minimal center adhesion. This allows wafer grinding and backside processing at high temperatures, while enabling low-force separation. The polymeric edge adhesive can be removed by solvent dissolution or other means.

Earlier this year Brewer released its own Cee 1300CSX thin wafer debond system that also incorporates the ZoneBOND technology, specifically targeting III-V and CS materials.