Mean Free Path for Vertical Carbon Nanotube Interconnects Approaches Copper

Carbon Nanotube (CNT) vias in integrated structures

Carbon Nanotube (CNT) vias in integrated structures

Carbon nanotubes (CNTs) have been explored as a material for vertical interconnects since they can handle higher current densities than copper and offer ballistic transport. This paper from IMEC demonstrates a 5x improvement in electron mean free path for CNTs compared to previous work. The CNT mean free path of 24-74nm approaches copper. Contact resistance is improved significantly compared to previous work as well.

[4.3. M. van der Veen, et al., “Electron Mean Free Path for CNT in Vertical Interconnects Approaches Copper”, imec]

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