SEMICON Taiwan is set to open in September amidst an improving global and regional outlook for 2013 and 2014 that sees Taiwan remaining the largest and strongest market for semiconductor manufacturing. SEMICON Taiwan 2013, to be held September 4-6 at the Taipei World Trade Center Nankang Exhibition Hall, will spotlight the latest developments in processes, equipment, materials, and emerging market opportunities in microelectronics manufacturing from more than 650 exhibiting companies and more than 110 speakers from the world’s leading technology companies and research organizations.
Bucking the global trend of contraction in semiconductor spending, Taiwan has continued to build its position as the leading market for semiconductor equipment through the first half of 2013. According to the Worldwide Semiconductor Market Statistics report published by SEMI and the Semiconductor Equipment Association of Japan (SEAJ), spending on semiconductor equipment in Taiwan in the first quarter of 2013 rose to US$ 2.8 billion, 31 percent above Q4 2012 and 60 percent higher than the first quarter of 2012. The latest SEMI Consensus Forecast projects the Taiwan equipment market will rise more than 9 percent in 2013 and another two percent in 2014 to reach $10.6 billion, maintaining Taiwan’s status as the world’s largest equipment market.
"While the global market is looking towards recovery in 2014, Taiwan is building its strength and growing now," said Terry Tsao, president of SEMI Taiwan. "New electronic products and technologies, including mobile devices and 3D printing, are creating entirely new opportunities for microelectronics and driving the need to push the limits of Moore’s Law to enable the next generation of innovations. The technologies, companies, and people that will get us there are the highlight of SEMICON Taiwan."
In addition to the company exhibits and product displays, SEMICON Taiwan 2013 will feature more than 50 hours of technical and business forums, including presentations from global and regional industry leaders ASE, GLOBALFOUNDRIES, IBM, Micron, STMicroelectronics, TSMC, and Qualcomm among others. Scheduled sessions include the SEMICON Taiwan Executive Summit, the IC Design Summit, Market Trends, Memory Executive Summit, CMP Forum, Lithography/Mask Symposium, Advanced Packaging Symposium, Green Manufacturing, and sessions on MEMS and LED manufacturing.
Complementing the technical and business programs at SEMICON Taiwan, the third SiP Global Summit, Taiwan’s leading conference focused on advanced packaging and test, will feature speakers and participation from leading companies including Amkor, SPIL, SPTS, Nanya, PCB, Unimicron, Teradyne, Qualcomm, Yole Développement, SUSS MicroTec, and Senju sharing their insights and solutions for accelerating volume 3D IC production. In addition to support from the SEMI Taiwan Packaging and Test Committee, the SiP Global Summit is also coordinated in conjunction with the Fraunhofer Institute, I-Shou University, and the Industrial Technology Research Institute (ITRI).