SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.55 billion in the second quarter of 2013. The billings figure is 3 percent higher than the first quarter of 2013 and 27 percent lower than the same quarter a year ago. The data is gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 100 global equipment companies that provide data on a monthly basis.
Worldwide semiconductor equipment bookings were $9.17 billion in the second quarter of 2013. The figure is five percent lower than the same quarter a year ago and 18 percent higher than the bookings figure for the first quarter of 2013.
The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows: