From smart cars to smart cities: Shaping the future of microelectronics at ITPC 2013

Experts in aerospace, automotive, mobile communications, Smart Cities and more join semiconductor leaders to shape the future of microelectronics at the International Technology Partners Conference (ITPC), to be held in Maui, Hawaii, on November 10-13. Teamwork and collaboration are critical elements of nearly all the major accomplishments of our time, and ITPC ( is specifically designed to create and promote business partnering dialog and relationships among the world’s top executives in the nano- and microelectronics manufacturing supply chains.  Now on its 28th edition, ITPC consistently attracts high-level executives from all over the world; this year the focus will be on addressing strategic investment and market and technology issues in the semiconductor value chain.

The participants at the International Technology Partners Conference have the power to alter the direction of the industry. From the speakers to attendees, their ideas drive technology roadmaps and shift market share.  Powerful speakers and a thought-provoking agenda are central to the event, with keynotes from:

  • IBM: Michael J. Cadigan, VP/GM, Microelectronics and Systems Technology Group
  • Intel: Wen-Hann Wang, VP, Intel Labs; director, Circuits and System Research
  • NASA Caltech Jet Propulsion Laboratory: Michael Watkins, Mission manager, Curiosity Mars Rover; manager, Science Division
  • Toyota Motor Corporation: Hiroyoshi Yoshiki, managing officer

ITPC’s three day agenda is business centric with a social component.  The format is designed with structured presentations and panel discussion on industry issues and unstructured free time for attendees to further explore topics of interest with other attendees.

Sessions include:

  • Growth Engines — Trends in Market Drivers: with Bill McClean, president, IC Insights and Raj Talluri, senior VP, product management, Qualcomm Technologies.
  • Driving towards the Future: Luc Van den hove, president and CEO, imec and James A. O’Neil, senior VP, Electronic Materials, ATMI Inc.
  • Engines of Innovation — Manufacturing Technology: Eric Meurice, chairman, ASML Holding and Atsuyoshi Koike, senior VP, Technology and Fab Operations, SanDisk; president, SanDisk (Japan) Limited
  • Accelerating Opportunities: Akihiko Tobe, GM, Smart City Project Division, Social Innovation Business Project Division, Hitachi, and Hans Stork, CTO, senior VP, ON Semi

This year, there are three panels at ITPC, which include: Engines of Learning: with Edwards Group, Egon Zehnder, KLA-Tencor, SanDisk (Japan), SMIC; Start Your Engines: CTO Principles of Innovation: with Applied Materials, Global 450mm Consortium (TSMC Assignee), Lam Research, VLSI Research, sk Hynix; and A Forum on Industry R&D Collaboration: with Global 450mm Consortium, IBM, imec, Intel, KLA-Tencor, Tokyo Electron America

ITPC is organized by SEMI and supported and sponsored by: ATMI, AZ Electronic Materials, Applied Materials, Ebara, Edwards, Hitachi High Tech, Horiba, KLA-Tencor, Lam Research, SCREEN, Tokyo Electron, Valqua America, Inc.

The International Technology Partners Conference will be held November 10-13, 2013 at the Wailea Beach Marriott in Maui, Hawaii. For registration and more information: visit


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