SEMI today announced a “Call for Papers” for the new Semiconductor Technology Symposium, the popular TechXPOT programs, and a new Science Park program featuring university research and advanced R&D subjects at SEMICON West, North America’s premier microelectronics event, to be held July 8-10 at the Moscone Center in San Francisco, Calif.  Presentation abstracts are due March 17, 2014.

SEMICON West 2014 will be attended by nearly 30,000 semiconductor and related microelectronics industry professionals and feature more than 60 hours of technical sessions, led by the most informed and influential experts in the world. The “standing-room only” success of the SEMICON West TechXPOT programs has prompted the creation of the new Semiconductor Technology Symposium (STS). Beginning in 2014, popular programs on leading-edge chip manufacturing will be held in a classroom setting with reserved seating adjacent to the show floor in the North Hall of Moscone Center. STS will offer technology trends, developments and new technology information in the areas of advanced materials and processing, lithography, metrology, 450mm, advanced packaging, 3D-IC.  Test Vision 2020, the leading semiconductor test conference focusing on ATE and high-volume manufacturing, will join the STS in the Moscone Center location.

TechXPOT programs in the Moscone Center North and South Halls will continue focusing on special topics in semiconductor manufacturing, and adjacent and related microelectronics technologies. An additional new program, Science Park, will feature a dedicated stage and exhibition area featuring advanced research and development technology topics centered on universities, research consortia, and R&D tools and technologies.

For the Semiconductor Technology Symposium, SEMI is soliciting technical presentations in the following areas:

·         Manufacturing nonplanar transistors
·         New and advanced metrology solutions
·         Advanced lithography
·         450mm wafer processing
·         Advanced materials and processes
·         Advanced packaging
·         Trends and technologies in 3D stacked IC
·         Semiconductor test
For TechXPOT sessions in North and South Hall of the Moscone Center, SEMI is soliciting technical presentations in the following areas:

·         Semiconductor test
·         Advanced packaging
·         Productivity solutions for 200mm and 300mm wafer processing
·         Accelerating and improving yield
·         MEMS manufacturing and technology
·         Enabling the Internet of Things
·         Manufacturing advanced power semiconductors
·         Printed and flexible electronics
The new Science Park program is soliciting technical presentations from universities and research consortia on advanced R&D topics, and tools and technology solutions for laboratory, research and pilot line microelectronics technology and manufacturing.
“The semiconductor programs at SEMICON West have grown to become one of the industry’s most unique and anticipated events, but have outgrown the TechXPOT locations on the show floor,” said Karen Savala, president of SEMI Americas. “The new Semiconductor Technology Symposium will allow us to improve and expand these programs with a high-quality classroom setting, convenient lunch and networking opportunities — providing an ideal setting and a better value for our attendees.”

Prospective presenters are invited to submit abstracts (maximum 500 words) on key industry issues and topics in the areas listed above for consideration. Presentations should focus on the latest developments and innovations in these technology areas, inclusive of supporting data. Submissions may be made online from the SEMICON West 2014 “Call for Participants” website at: www.semiconwest.org/Participate/SPCFP.

The deadline for abstract submission is March 17, 2014.