The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent. Revenues of $43.5 mark the second consecutive year of contraction for the semiconductor materials market.

Total wafer fabrication materials and packaging materials were $22.76 billion and $20.70 billion, respectively. Comparable revenues for these segments in 2012 were $23.44 billion for wafer fabrication materials and $21.36 billion for packaging materials. For the second year in a row, substantial declines in silicon revenue, advanced substrates, and bonding wire contributed to the year-over-year decrease to the total semiconductor materials market.

For the fourth consecutive year, Taiwan was the largest consumer of semiconductor materials due to its large foundry and advanced packaging base, despite not experiencing any annual growth. The materials market in North America also remained flat year-over-year. The materials markets in China and Europe increased in 2013, benefiting from strength in wafer fab materials. The materials market in Japan contracted 12 percent, with markets also contracting in South Korea and Rest of World. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.)

2012-2013 Semiconductor Materials Market by World Region
(Dollar in U.S. billions; Percentage Year-over-Year)

Source: SEMI April 2014

Note: Figures may not add due to rounding.

* 2012 data were revised based on the recently released Global Semiconductor Packaging Materials Outlook- 2013/2014.