3D Integration: The Most Effective Path for Future IC Scaling

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3D Integration

Date: Thursday, April 23, 2015 at 12:00 p.m. EST

Free to attend

Length: Approximately one hour

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It is well recognized that dimensional scaling has reached its diminishing return phase. The industry is now looking at monolithic 3D to be the future technology driver. Yet, until recently, the path to monolithic 3D has required the development of new transistor types and processes. This Webcast will present game-changing monolithic 3D process flows which use the existing transistor of existing manufacturing line and existing process flows. Now the most effective path for future IC scaling is indeed monolithic 3D, which offers the lowest development and manufacturing cost for future ICs.

PDF of Dr. Vinet’s presentation is available here.

PDF of Mr. Or-Bach’s presentation is available here.


Maud VinetDr. Maud Vinet, Advanced CMOS Manager, CEA/Leti

Dr. Maud Vinet is in charge of the Advanced CMOS Laboratory at CEA Leti in Grenoble, France, a position she has held since 2013. The laboratory pursues conventional scaling through improved electrostatics and transport properties, and also studies alternative paths to conventional scaling either by stacking CMOS over CMOS in a monolithic 3D integration or by adding beyond CMOS devices (Tunnel FET, Single Electron Transistor, nano-mechanical switches) to CMOS to develop a hybrid logic with an optimized cost-energy efficiency trade-off. Maud Vinet has authored or co-authored more than 120 papers (conferences and journals) and owns 40 patents related to nanotechnology.

Zvi Photo DSCN0809 !Zvi Or-Bach, President and CEO of MonolithIC 3D Inc.

Zvi Or-Bach is the founder President and CEO of MonolithIC 3D Inc. Or-Bach has more than 30 years of innovative development including the breakthroughs of monolithic 3D ICs and fast-turn ASICs. Prior to MonolithIC 3D, Or-Bach founded eASIC in 1999 and served as the company’s CEO for six years (eASIC is in process of IPO these days).

Earlier, Or-Bach founded Chip Express in 1989 (recently acquired by Gigoptix) and served as the company’s President and CEO for almost 10 years, bringing the company to $40M revenue. He holds over 150 issued patents, primarily in the field of 3D integrated circuits and semi-custom chip architectures. He is the Chairman of the Board for Zeno Semiconductors, Bioaxial and VisuMenu.

Sponsored by Nordson DAGE

Nordson DAGE is part of the Advanced Technology – Electronics Systems Group of Nordson Corporation (NASDAQ: NDSN) and manufactures and supports a complete range of Industry leading Test and Inspection equipment for the PCBA and Semiconductor industries.  The Nordson DAGE XM8000 Wafer Metrology Platform provides an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps and provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions. www.measuringtheinvisible.com


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