The 17th annual IITC will be held May 21 – 23, 2014 in conjunction with the 31st AMC at the Doubletree Hotel in San Jose, California, representing an annual series of meetings devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications. It will be preceded by a day-long workshop on “Manufacturing of Interconnect Technologies: Where are we now and where do we go from here?” today, Tuesday, May 20.
The 2014 IITC/AMC will focus on innovative developments in the critically important field of interconnections for electronic systems, presenting papers on all aspects of interconnects for device, circuit board and system-level applications. Topics include both fundamental and applied research, as well as issues related to introduction of enabling technologies into manufacturing. This year’s conference intends to provide a forum for open discussions ranging from basic science to industrial application, targeting material scientists, process and integration engineers and PhD students active in the areas of semiconductor processing, advanced materials, equipment development, and interconnect systems.
Further details are available at the conference website: http://www.ieee.org/conference/iitc