SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) today jointly announce the creation of the Chemical Mechanical Planarization (CMP) Center, based at the Albany Nanotech Complex. The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

“In support of Governor Andrew Cuomo’s commitment to New York’s global leadership in developing next generation technologies, we are excited to partner with SEMATECH to develop technology for the manufacturing of future nanoelectronics devices,” said Christopher Borst, Associate Vice President for G450C Technical Operations and Associate Professor of Nanoengineering at the newly merged CNSE/SUNYIT. “Through access to the newly merged CNSE/SUNYIT’s advanced fabrication facilities, we will enable a center of excellence with world-class capabilities for development of leading-edge process solutions for future generation technologies.”

“The CMP Center is an important part of our strategy to provide our members with the critical capabilities needed to accelerate process maturity for end users,” said Edward Barth Director of Growth Initiatives at SEMATECH. “In addition to SEMATECH’s network of consortium members, the newly merged CNSE/SUNYIT’s leadership in providing state-of-the-art process and metrology toolsets will enable the development of new materials and CMP processes in further scaling of IC devices.”

As semiconductor dimensions are scaled, advances in test structures and process flows are critical for accelerating process development to support industry needs.  The new planarization center, a vital component of the newly merged CNSE/SUNYIT and SEMATECH’s process technology efforts, will serve as a technology test-bed that will enable participating companies to develop, demonstrate, integrate and qualify advanced CMP technologies for the semiconductor industry.

“The CMP community have been asking for this and the newly merged CNSE/SUNYIT and SEMATECH have responded loud and clear,” said Frank Tolic, Associate Vice President for Business, Wafer Processing of the newly merged CNSE/SUNYIT.  “Leveraging our combined strengths creates the next generation of cost effective test vehicles, test wafers, and industry know-how that will lead the CMP community successfully through the next technology generations.”

“This collaborative venture incorporates the newly merged CNSE/SUNYIT’s and SEMATECH’s joint technical expertise and industry vision, with CNSE/SUNYIT’s state-of-the-art equipment,” said Satyavolu Papa Rao, Director of Process Technology, SEMATECH. “The entire CMP ecosystem, including consumable suppliers, tool and metrology vendors, and end users such as IDMs, foundries and fabless companies, can partner to establish industry standard test structures and develop solutions to meet the needs of sub-20 nm technology nodes.”

The new CMP Center, along with other Centers being established, will create cross-center synergies to drive technical excellence and reduce the overall cost of ownership in the development of next-generation technology.


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