MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.
MEI’s Critical Etch batch wet processing systems achieve comparable etch uniformity, providing superior results when compared to single wafer spray tools for Cu and TiW Etch. Additionally, MEI’s critical etch solution enables consistent etching even within dense patterned areas. The superior immersion etch uniformity enables process engineers to minimize over etch times enabling the use of lower cost immersion technology to produce high end products. MEI’s critical etch system also saves valuable manufacturing floor space by reducing the wet process footprint requirement by at least 60% over comparable throughput single wafer spray tools.
“MEI’s Critical Etch solution for Au, Ag, Cu and TiW will allow semiconductor manufacturers to lower costs, reclaim valuable cleanroom space and increase yield while producing high quality results,” said Dan Cappello, President and CEO, MEI LLC. “Our immersion system etch uniformity far surpasses many alternative solutions. Side by side ‘split lot’ comparison data demonstrates superior performance with <2% etch uniformity, compared to >15% for other immersion and spray tool designs.”
About MEI’s Critical Etch wet processing system—a new approach.
MEI’s Critical Etch System is unlike conventional metal etch systems. We leveraged our immersion experience to produce a low cost, small footprint, high performance package. Our systems can be configured for single or combination metal etch steps over a wide variety of needs. Conventional etch solutions rely on -dry tool or complex deplating processes which are very expensive to operate. MEI’s immersion solution enables a new generation of mobile devices to be produced in a cost effective manner.
MEI’s batch immersion system’s are field proven on 1- 5 um features which were consistently etched with exceptional uniformity and high throughput.
MEI’s Critical Etch solution targets semiconductor and MEMS processing applications where metal pattern etches are required to create todays most sophisticated mobile communication devices.