Honeywell advanced materials help mobile devices dissipate heat

Honeywell Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better.

Leading mobile electronics manufacturers are using Honeywell’s thermal interface materials (TIMs) to dissipate the intense heat produced by increasingly powerful chips at the heart of these devices. If not managed properly, the heat can lead to performance issues and even cause the devices to stop performing altogether.

“End users demand a lot from their devices and our materials help manufacturers manage heat that can threaten performance and longevity,” said David Diggs, vice president and general manager of Honeywell Electronic Materials. “Our TIM product offerings, which are based on more than a half century of knowledge developing materials for the semiconductor industry, are helping device manufacturers meet the growing expectations as mobile devices continue to be central to everyday life.”

Honeywell develops thermal management solutions that transfer and dissipate heat from advanced semiconductor devices. Honeywell’s PTM and PCM series of thermal management materials are based on sophisticated phase-change chemistry and advanced filler technology that was developed specifically for high-performing electronic devices.

TIMs technology from Honeywell transfers thermal energy from the chip to the heat sink or spreader, where it is dissipated into the surrounding environment. This functionality keeps the chip cool while allowing the heat sink module to perform optimally.

Honeywell’s patented formulations provide long-lasting chemical and mechanical stability, enabling consistently higher thermal performance compared with alternative thermal interface materials that break down or dry out.

This stability has been proven through the industry’s most widely accepted accelerated aging tests including: extended baking at 150 degrees Celsius (more than 300 degrees Fahrenheit); thermal cycling from -55 to 125 degrees Celsius (-67 to 257 degrees Fahrenheit); and the Highly Accelerated Stress Test (HAST). Honeywell’s TIM offerings meet aggressive thermal needs such as thin bond line capability, low thermal impedance and long-term reliability.

Honeywell Electronic Materials, part of Honeywell Performance Materials and Technologies, supplies microelectronic polymers, electronic chemicals, and other advanced materials along with an extensive set of product offerings under its metals business segment, including physical vapor deposition (PVD) targets and coil sets, precious metal thermocouples, and low alpha emissivity plating anodes and advanced heat spreader materials used during back-end packaging processes for thermal management and electrical interconnect.


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