3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications (Source: 3DIC & 2.5D TSV Interconnect for Advanced Packaging Business Update report). Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube … have all brought devices to the market that integrate 3D TSV technology.

“TSV’s added- value is important: increased performance and functionality, more compact devices, more efficient utilization of the silicon space,” explained Yole Développement (Yole). Moreover, even if 3D TSV process steps are adding cost at the device manufacturing level, these technologies enable cost- saving in other parts of the supply chain.

“No more doubts about adoption of 3D TSV platform across a wider range of applications: all key players added 3D TSV into their roadmaps, engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” said Rozalia Beica, CTO & Business Director, Advanced Packaging and Semiconductor Manufacturing at Yole. This year, the industry witnessed several memory product announcements for high-end applications, with transfer to volume production planned in the near future.

“Driven by the demand to further increase in performance, 2015 will be the year for the implementation of 3D TSV technology in high volume production,” explains Rozalia.

The market research and strategy consulting company, Yole and its advanced packaging team, are closely studying and monitoring the industry’s activities in this field. The latest results can be found in Yole’s new 3DIC & 2.5D Business Update Report published this year.

Yole’s vision on further 3D TSV technology adoption will be presented during the European 3D TSV Summit 2015 in Grenoble. The company is partnering with SEMI to support the European TSV Summit, which will take place in Grenoble, France on January 19 to 21, 2015. The European 3D TSV Summit is organized by SEMI Europe. To meet Yole’s experts, discover the detailed program and register, click European 3D TSV Summit 2015.

Also, at the European 3D TSV Summit, Jean-Christophe Eloy, President & CEO, Yole will moderate the panel discussion, “From TSV Technology to Final Products – What is the Business for 3D Smart Systems?” taking place on Tuesday 20, at 5:20 PM. Jean-Christophe will highlight 3D TSV market trends and technology challenges, especially its integration for 3D smart systems application. He will welcome the following panelists: Ron Huemoeller, Senior VP Advanced Product / Platform Development, AMKOR – Martin Schrems, VP of R&D, ams AG – Bryan Black, Senior Fellow, AMD – Mustafa Badaroglu, Senior Program Manager, Qualcomm.

In parallel, Rozalia Beica will be part of the Market Briefing Symposium, on Monday 19. Her presentation is entitled: “From Development to Manufacturing: An Overview of Industry’s 3D Packaging Activities”.

“We are excited to have a group of highly qualified market experts, such as Yole Développement, joining us this year for the European 3D TSV Summit,” stated Anne-Marie Dutron, Director of SEMI Europe’s Grenoble office. “To highlight the adoption of 3D TSV technology in several market applications and to answer the demand from our members, we have given the business aspects of the 3D TSV industry more importance in this 2015 edition.”

The European 3D TSV Summit final program is now available.