Yearly Archives: 2015

Full high-definition (FHD) panels reached a record 21 percent of the smartphone display market in the third quarter (Q3) of 2015, due in large part to increases in active-matrix organic light-emitting diode (AMOLED) panel adoption by Samsung and others. Increasing demand from the Chinese smartphone market, and the popularity of the Apple iPhone 6S Plus, also added to growth in unit shipments of FHD panels that are able to show 1080p images, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight. AMOLED displays comprised 18 percent of all smartphone display unit shipments in Q3 2015, up from 10 percent in Q3 2014.

The Samsung group has relied on AMOLED as an important differentiating feature in its proprietary Galaxy smartphones for six years, as it helps the company achieve better color performance, on-cell touch, and slimmer and lighter form factors. To expand market adoption, Samsung Display recently changed its smartphone display strategy to begin selling AMOLED panels to external customers.

Beginning in the second half of 2015, OPPO, Gionee, vivo, Meizu, Lenovo, Huawei and other smartphone brands, installed AMOLED in their devices. Meanwhile, products like the Google Nexus 6P, the Microsoft Lumia 950XL, the Meizhu Pro 5, and the recently announced BlackBerry Priv now have AMOLED displays.

“2015 will be a banner year for AMOLED as the technology will soon be included in high-end smartphones from many other companies,” said David Hsieh, senior analyst for IHS Technology. “The simpler structure and better picture performance of AMOLED screens may even encourage Apple to consider adopting the technology in the future.”

The plus-sizing of smartphones continues

Led by the rising popularity of the iPhone 6S Plus and other large smartphones, unit shipments of 5.0-inch-and-larger displays surpassed those of smaller displays for the first time in Q3 2015. While quarter-over-quarter unit shipments of 5.0-inch-and-larger displays grew 21 percent to reach 247 million units in Q3, smartphone displays smaller than 5.0 inches fell 6 percent to 156 million units.

Unit shipments of 5.0-inch smartphone panels experienced the largest growth of any size, jumping from 93 million in Q2 2015 to 104 million in Q3, which is the first time 5.0-inch shipments exceeded 100 million units in a single quarter. Thanks to the iPhone 6S Plus and other new models manufactured in China, 5.5-inch smartphone panels grew from 65.6 million in Q2 2015 to 79.8 million in Q3. Screen sizes of 6 inches and larger have not been as popular with smartphone buyers, so growth in that size range has been marginal.

Apple’s use of Force Touch technology in the Apple Watch and 3D Touch in the iPhone 6S line is leading to growth in force sensing and other touch-panel enhancements in mobile devices. Other brands and integrated-circuit (IC) makers are now responding by preparing their own force sensing solutions, mainly for high-end and mid-range smartphones due to the high cost. In 2016, force sensing module shipments are expected to grow 317 percent to reach 461 million units in 2016. Nearly one quarter (24 percent) of new smartphones shipped will include the technology, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

“Aside from force sensing solutions, touch controller IC makers are aggressively expanding production of in-cell and on-cell touch displays to further improve touch interfaces for smartphone users,” said Calvin Hsieh, director of touch and user interface research for IHS Technology. According to the latest IHS Touch User Interface Reportin-cell and on-cell touch panel shipments will reach 40 percent of all mobile phone touch-panel shipments in 2015, rising to 50 percent in 2018. “Smartphone touch controller IC makers are focused on developing new features to spur growth in the maturing touch panel market.”

The ongoing evolution in the touch-panel industry is also changing the supply chain and affecting competition. Touch controller IC makers, primarily in Taiwan and China, accounted for more than 45 percent of the market for major information technology and consumer electronics products in the first half of 2015.

The global market for semiconductors used in electric vehicle (EV) charging stations for plug-in hybrid (PH) and battery electric vehicles (BEV) will continue to expand in the coming years, providing significant growth opportunities to semiconductor manufacturers.  Revenue from semiconductors used in EV charging stations reached $44 million in 2014 and is expected to grow at a compound annual growth rate (CAGR) of 39 percent to reach $233 million in 2019, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

“Fast charging is a necessary step to the strong adoption of EVs and a higher power rating is required to support these shorter charging times,” said Noman Akhtar, industrial semiconductors analyst for IHS Technology. “Electric vehicle charging stations with higher ratings require more power semiconductors, especially discrete semiconductor components, which will lead to increased semiconductor revenue growth.”

In 2014, the average price for semiconductor components in a level-two charging station — which could charge a battery in about five hours — was $143. By comparison, semiconductor components used in the latest fast-charging direct-current (DC) chargers now cost more than $1,000; however, they are capable of charging a vehicle battery to 80 percent of capacity in just 15 minutes.

Average selling prices of semiconductors used in communication modules are expected to increase over time, as the industry moves toward single system-on-chip (SoC) solutions that not only provide faster control, but also include the memory required for secure communications and other applications. “Better communication between the utility and the charger improves the stability of the electric grid,” Akhtar said. “The latest developments in communication interface ICs enable more secure and reliable information transfer.”

TowerJazz, the global specialty foundry, announced the signing of a definitive agreement with Semiconductor Laboratory, an Asian Governmental Agency. Under the agreement, TowerJazz will leverage its manufacturing expertise and assets while providing during the coming three years the required process engineering and equipment maintenance support for successful operation of the facility. In addition, TowerJazz will provide support to help establish wafer reclaim capabilities and will provide training and procedures on the establishment of chemical lab capabilities.

The deal will generate revenues of approximately $35 million, which are incremental to TowerJazz’s revenues from its existing manufacturing facilities. This agreement allows TowerJazz to realize profits and cash generation from its valuable manufacturing expertise and its skilled engineering manpower.

“This project represents another notable acknowledgement of our worldwide manufacturing expertise and capabilities,” said Mr. Russell Ellwanger, CEO of TowerJazz. “It is a special business model providing revenue and profit upside incremental to our base financial model.”

TowerJazz operates two manufacturing facilities in Israel (150mm and 200mm), one in the U.S. (200mm) and three additional facilities in Japan (two 200mm and one 300mm) through TowerJazz Panasonic Semiconductor Co. (TPSCo), established with Panasonic Corporation of which TowerJazz has the majority holding.

Teams of researchers from the University of Illinois at Urbana-Champaign (UIUC) have demonstrated a biosensor capable of counting the blood cells electrically using only a drop of blood. The blood cell count is among the most ubiquitous diagnostic tests in primary health care. The gold standard routinely used in hospitals and testing laboratories is a hematology analyzer, which is large and expensive equipment, and requires trained technicians and physical sample transportation. It slows turn-around time, limits throughput in hospitals, and limits accessibility in resource-limited settings. Bashir and his team have developed a biosensor to count red blood cell, platelet, and white blood cell counts, and its 3-part differential at the point-of-care while using only 11 microL of blood.

(a) Schematic of the biosensor used for total leukocyte and its differential counts. The inset shows the micro-fabricated coplanar electrodes aligned with the cell counting aperture of cross-section 15 µm x 15 µm. (b) Representative voltage pulses generated as the individual cells pass over the electrodes. (c) The pulse amplitude histogram shows the distinct populations of lymphocytes and granulocytes + monocytes. CREDIT: TECHNOLOGY

The microfluidic device can electrically count the different types of blood cells based on their size and membrane properties. To count leukocyte and its differentials, red blood cells are selectively lysed and the remaining white blood cells were individually counted. The specific cells like neutrophils were counted using multi-frequency analysis, which probe the membrane properties of the cells. However, for red blood cells and platelets, 1 microL of whole blood is diluted with PBS on-chip and the cells are counted electrically. The total time for measurement is under 20 minutes. The report appears in the December 2015 issue of the journal TECHNOLOGY.

“Our biosensor exhibits the potential to improve patient care in a spectrum of settings. One of the compelling is in resource-limited settings where laboratory tests are often inaccessible due to cost, poor prevalence of laboratory facilities, and the difficulty of follow-up upon receiving results that take days to process,” says Professor Rashid Bashir of the University of Illinois at Urbana-Champaign and Principal Investigator on the paper.

There exists a huge potential to translate our biosensor commercially for blood cell counts applications,” says Umer Hassan, Ph.D., the lead author on this paper. “The translation of our technology will result in minimal to no experience requirement for device operation. Even, patients can perform the test at the comfort of their home and share the results with their primary care physicians via electronic means too.” “The technology is scalable and in future, we plan to apply it to many other potential applications in the areas of animal diagnostics, blood transfusion analysis, ER/ICU applications and blood cell counting for chemotherapy management” says Professor Bashir. The clinical trials of the biosensor are done in collaboration with Carle Foundation Hospital, Urbana, IL.

The team from UIUC is working now to further develop a first portable prototype of the cell counter. “The cartridges will be disposable and the size of a credit card. The base unit or the reader will be portable and possibly hand-held. Our technology has the potential to reduce the cost of the test to less than $10 as compared to $100 or more currently charged,” says Umer.

Engineers at MIT have devised a new technique for trapping hard-to-detect molecules, using forests of carbon nanotubes.

The team modified a simple microfluidic channel with an array of vertically aligned carbon nanotubes — rolled lattices of carbon atoms that resemble tiny tubes of chicken wire. The researchers had previously devised a method for standing carbon nanotubes on their ends, like trees in a forest. With this method, they created a three-dimensional array of permeable carbon nanotubes within a microfluidic device, through which fluid can flow.

Now, in a study published this week in the Journal of Microengineering and Nanotechnology, the researchers have given the nanotube array the ability to trap certain particles. To do this, the team coated the array, layer by layer, with polymers of alternating electric charge.

“You can think of each nanotube in the forest as being concentrically coated with different layers of polymer,” says Brian Wardle, professor of aeronautics and astronautics at MIT. “If you drew it in cross-section, it would be like rings on a tree.”

Depending on the number of layers deposited, the researchers can create thicker or thinner nanotubes and thereby tailor the porosity of the forest to capture larger or smaller particles of interest.

The nanotubes’ polymer coating may also be chemically manipulated to bind specific bioparticles flowing through the forest. To test this idea, the researchers applied an established technique to treat the surface of the nanotubes with antibodies that bind to prostate specific antigen (PSA), a common experimental target. The polymer-coated arrays captured 40 percent more antigens, compared with arrays lacking the polymer coating.

Wardle says the combination of carbon nanotubes and multilayer coatings may help finely tune microfluidic devices to capture extremely small and rare particles, such as certain viruses and proteins.

“There are smaller bioparticles that contain very rich amounts of information that we don’t currently have the ability to access in point-of-care [medical testing] devices like microfluidic chips,” says Wardle, who is a co-author on the paper. “Carbon nanotube arrays could actually be a platform that could target that size of bioparticle.”

The paper’s lead author is Allison Yost, a former graduate student who is currently an engineer at Accion Systems. Others on the paper include graduate student Setareh Shahsavari; postdoc Roberta Polak; School of Engineering Professor of Teaching Innovation Gareth McKinley; professor of materials science and engineering Michael Rubner, and Raymond A. And Helen E. St. Laurent Professor of Chemical Engineering Robert Cohen.

A porous forest

Carbon nanotubes have been a subject of intense scientific study, as they possess exceptional electrical, mechanical, and optical properties. While their use in microfluidics has not been well explored, Wardle says carbon nanotubes are an ideal platform because their properties may be manipulated to attract certain nanometer-sized molecules. Additionally, carbon nanotubes are 99 percent porous, meaning a nanotube is about 1 percent carbon and 99 percent air.

“Which is what you need,” Wardle says. “You need to flow quantities of fluid through this material to shed all the millions of particles you don’t want to find and grab the one you do want to find.”

What’s more, Wardle says, a three-dimensional forest of carbon nanotubes would provide much more surface area on which target molecules may interact, compared with the two-dimensional surfaces in conventional microfluidics.

“The capture efficiency would scale with surface area,” Wardle notes.

A versatile array

The team integrated a three-dimensional array of carbon nanotubes into a microfluidic device by using chemical vapor deposition and photolithography to grow and pattern carbon nanotubes onto silicon wafers. They then grouped the nanotubes into a cylinder-shaped forest, measuring about 50 micrometers tall and 1 millimeter wide, and centered the array within a 3 millimeter-wide, 7-millimeter long microfluidic channel.

The researchers coated the nanotubes in successive layers of alternately charged polymer solutions in order to create distinct, binding layers around each nanotube. To do so, they flowed each solution through the channel and found they were able to create a more uniform coating with a gap between the top of the nanotube forest and the roof of the channel. Such a gap allowed solutions to flow over, then down into the forest, coating each individual nanotube. In the absence of a gap, solutions simply flowed around the forest, coating only the outer nanotubes.

After coating the nanotube array in layers of polymer solution, the researchers demonstrated that the array could be primed to detect a given molecule, by treating it with antibodies that typically bind to prostate specific antigen (PSA). They pumped in a solution containing small amounts of PSA and found that the array captured the antigen effectively, throughout the forest, rather than just on the outer surface of a typical microfluidic element.

Wardle says that the nanotube array is extremely versatile, as the carbon nanotubes may be manipulated mechanically, electrically, and optically, while the polymer coatings may be chemically altered to capture a wide range of particles. He says an immediate target may be biomarkers called exosomes, which are less than 100 nanometers wide and can be important signals of a disease’s progression.

“Science is really picking up on how much information these particles contain, and they’re sort of everywhere, but really hard to find, even with large-scale equipment,” Wardle says. “This type of device actually has all the characteristics and functionality that would allow you to go after bioparticles like exosomes and things that really truly are nanometer scale.”

By Dr. Phil Garrou, Contributing Editor

At the 12th annual 3D ASIP [Architectures for Semiconductor Interconnect and Packaging] Conference, sponsored by RTI Int, in Redwood City CA last week, Professor Mitsumasa Koyanagi of Tohoku University and Dr. Peter Ramm of Fraunhofer EMFT were the conference’s first recipients of the “3DIC Pioneer Award”.

Conference Chair Dr. Phil Garrou from Microelectronic Consultants of NC commented, “Since we are now more than a decade into the concerted effort to commercialize 2.5 and 3DIC technology it seemed appropriate to look back and document who actually led the way in this technically challenging effort. After significant study, we are convinced that the research groups in Tohoku University and Fraunhoffer – Munich were not only the first in the field, but also have continued their studies to this day to help commercialize this important leading edge technology.”

Professor Koyanagi (left) and Dr. Ramm (right) accept                                                           3DIC Pioneering Award from conference chair Garrou.

Professor Koyanagi (left) and Dr. Ramm (right) accept 3DIC Pioneering Award from conference chair Garrou.

Profesor Koyanagi’s work started back with his seminal paper “Roadblocks in achieving 3-dimensional LSI” presented at the Symposium on Future Electronic Devices in 1989. His 1995 paper “Three dimensional Integration Technology Based on a Wafer Bonding Technique Using Micro Bumps” showed a process sequence similar to todays TSV etch, thin and bond for an image sensor circuit.

Dr. Ramm began his work in the early 1990s in collaboration with Siemens under the German sponsored R&D program “Cubic Integration – VIC”. Their paper “Performance Improvement of the Memory Hierarchy of RISC-Systems by Application of 3-D Technology,” which appeared in IEEE Trans on Components, Packaging and Manufacturing Technology in 1996 woke up the larger community to the possibilities of using 3DIC. A key patent from that era was USP 5,563,084 “Method of Making a 3 Dimensional Integrated Circuits” which issued in 1996.

SAMCO has developed and launched a new Atomic Layer Deposition (ALD) system focusing on gate oxide formation of Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices, which are key for energy-saving devices or “green electronics.”

SAMCO AL-1

SAMCO is a global semiconductor equipment company that designs and manufactures dry etching systems, PECVD, and UV-Ozone and Plasma cleaning systems. The company’s success has been driven by delivering innovative processing solutions for wide band-gap semiconductor devices such as RF devices, LEDs, laser diodes and power devices.

SAMCO’s new ALD system, “AL-1”, deposits pinhole-free AlOx and SiO2 films, which are optimal for gate oxide of GaNMOSFET, GaNMOS-HFET and 4H-SiCMOSFET devices. The system features precise film thickness control at the atomic layer level (1.2Å per cycle at a deposition temperature of 350 °C). The high-quality deposited AlOx film (breakdown voltage of 7.5 MV/cm) also provides excellent step coverage (aspect ratio of 32:1, 1.25μm width, and 40 μm depth) with just 103 nm thick oxide films.

The AL-1 is capable of depositing uniform oxides on an 8-inch wafer or three 4-inch wafers and is suitable for R&D and pilot production.

To strengthen turn-key solutions for next-generation power device production, SAMCO signed a distributor agreement with Epiluvac, a Swedish manufacturer of SiC CVD systems, on December 1, 2015. The AL-1 continues SAMCO’s success in providing highly reliable and cost-effective process solutions for the SiC and GaN power device markets.

Congress took a major step in supporting U.S. manufacturing and innovation today by voting to make the federal Research and Development (R&D) tax credit permanent. SEMI has been working to make the popular tax incentive a permanent part of the tax code since the R&D credit was first established in 1981.

“SEMI members invest and average of 15 percent of their revenues back into R&D activities every year,” said SEMI president & CEO, Denny McGuirk. “Being able to count on the R&D tax credit is immensely important to our members, which are some of the most innovative companies in the world.”

In its temporary status, the credit was widely used by many SEMI member companies; however, it was often not reliable because of its temporary status. In the past 34 years, the credit had expired 17 times, and on more than one occasion, was expired for almost an entire tax year before being retroactively reinstated. By making the credit permanent, companies will now be able to plan their long term research and development projects with greater certainty.

The permanent provision for innovation-supporting tax policy was included in the wide-ranging year-end “tax extenders” bill that was then combined with the omnibus appropriations legislation to fund the government through September 2016. Included in the same legislation is an extension of the popular solar energy Investment Tax Credit (ITC). The 30 percent ITC, which was set to be reduced to 10 percent at the end of 2016, has been critical to the wide-scale deployment of solar photovoltaic panels in the U.S. With the passage of this bill, the 30 percent credit will be extended until 2019, and then gradually phased down to 10 percent at the end of 2021.

“Both the R&D Credit and the ITC are good examples of why SEMI engages with policymakers in Washington, D.C. on behalf of our members,” continued McGuirk. “SEMI, our members, and many others in the high tech community have long advocated for this change. Our collective persistence has resulted in important and meaningful support for innovation.”

SEMI is the global industry association serving the electronics manufacturing supply chains.

North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2015 (three-month average basis) and a book-to-bill ratio of 0.96, according to the November EMDS Book-to-Bill Report published today by SEMI.  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

SEMI reports that the three-month average of worldwide bookings in November 2015 was $1.24 billion. The bookings figure is 6.7 percent lower than the final October 2015 level of $1.33 billion, and is 1.7 percent higher than the November 2014 order level of $1.22 billion.

The three-month average of worldwide billings in November 2015 was $1.29 billion. The billings figure is 5.2 percent lower than the final October 2015 level of $1.36 billion, and is 8.3 percent higher than the November 2014 billings level of $1.19 billion.

“The semiconductor equipment book-to-bill ratio continued to decelerate in the fourth quarter,” said Denny McGuirk, president and CEO of SEMI.  “In light of this recent softening and with the currently strong U.S. dollar, SEMI anticipates that the total equipment market (billings) will be flat to slightly down this year vs. last year as reported in U.S. dollars.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

June 2015

$1,554.9

$1,517.4

0.98

July 2015

$1,556.2

$1,587.3

1.02

August 2015

$1,575.9

$1,670.1

1.06

September 2015

$1,495.0

$1,554.9

1.04

October 2015

$1,358.6

$1,325.6

0.98

November 2015 (prelim)

$1,287.9

$1,237.1

0.96

Source: SEMI (www.semi.org)December 2015