Semiconductor equipment manufacturer ClassOne Technology announced the sale and delivery of its Solstice S8 Plating System to Advanced Wireless Semiconductor Company (AWSC) of Taiwan. The fully automated Solstice S8 will be installed at the AWSC facility in the Tainan Industrial Park in Taiwan where it will be used for volume manufacturing processes such as lead-free wafer level packaging (WLP) and through wafer vias (TWV) used in the manufacture of RF and other microdevices.
“Foundries often need to weigh performance and price carefully, and we believe the S8 strikes the right balance,” said Kevin Witt, ClassOne’s V.P. of Technology. “For example, the Solstice can enable a customer to move Copper Pillar, Nickel, Tin Bump, and Cu Backside Via production from several wet benches onto a single automated tool that gives a better process result and higher productivity. In addition, ClassOne supports customers with process development and deployment every step of the way.”
“Solstice fills a void in the market between wet benches on the low end and the large, expensive 300mm plating systems on the high end,” said Win Carpenter, ClassOne’s V.P. of Global Sales. “The Solstice S8 was designed to provide advanced plating performance at a reasonable cost for everyone who manufactures on 200mm and smaller substrates. Those users include many emerging markets such as MEMS, LEDs, RF, power, and sensors.”
The Solstice electroplating systems were introduced in 2014 and are available in fully automated, 4- and 8-chamber configurations that deliver up to 75 wph of capacity. The Solstice family handles substrates up to and including 200mm, whether transparent or opaque, and performs key processes such as electroplating of various metals and alloys. Solstice pricing is less than half that of similarly configured 300mm plating systems outfitted for 200mm from the large manufacturers.