Isolating Electrical Faults in Advanced IC Devices

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Isolating Electrical Faults in Advanced IC Devices

Date: July 29, 2015 at 2:00 p.m. ET

Free to attend

Length: Approximately one hour

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Yield improvement and production engineers working on today’s ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques.  Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA).  In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.


Jordan FineJordan Fine, Applications Engineer, DCG Systems

Jordan Fine is a Staff Applications Development engineer for the Circuit Analysis group at DCG Systems. His primary focus is the development of new optical fault isolation (OFI) techniques for the Meridian and WaferScan platforms. He also supports a worldwide customer base that debugs the most advanced technology nodes using OFI. Dr. Fine holds a Ph.D. from the University of Southern California and has published multiple papers in the fields of molecular physics and electronic failure analysis.

jennifer koppJennifer Kopp, Product Marketing Director, DCG Systems

Jennifer Kopp is the Product Marketing Director for the Meridian optical fault isolation product line at DCG Systems.  She has 15 years experience in the semiconductor capital equipment industry including technical product marketing and applications development roles in the Electrical Failure Analysis, Inspection & Metrology, and process equipment segments. Jennifer holds a B.S. degree in Chemical Engineering from Cornell University and lives in Fremont, California.  She can be reached at [email protected]

Sponsored by DCG Systems, Inc.

DCG Systems, Inc. is the industry’s leading supplier of systems that enable direct localization and characterization of electrical faults in integrated circuits, packages and board assemblies. DCG Systems are used worldwide throughout the electronics product life cycle, from IC process development and design de-bug, to yield ramp and yield enhancement, to supporting advanced packaging engineering, and finally to failure analysis of customer returns.

DCG Systems has more than 1500 systems deployed worldwide, and serves its global customer base from its headquarters in Fremont, California and its field offices in the United States, Japan, Taiwan, Korea, Malaysia, Singapore, Israel and Germany. For more information about DCG Systems, visit


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