“Above and beyond TSV for advanced ICs” – SEMI European 3D Summit 2016

SEMI today announced the fourth annual European 3D Summit. Entitled “European 3D Summit 2016: Above and Beyond TSV,”  the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

The 2016 SEMI European 3D Summit will include a wide scope of 3D integrated circuit topics beyond Through-Silicon-Via (TSV) technology – with talks on FO-WLP/ e-WLB, Embedded Die, and 3D alternative technologies. Keynote and invited speakers will present their approaches and strategies for 3D Integration technologies, with specific attention on current adoption for applications such as memory, mobile, automobiles, wearables and more.

The increasing implementation of 3D technology in microelectronics devices has reshaped the electronics market. SEMI will highlight the latest business challenges and opportunities with a market briefing where 3D and packaging industry experts will present business and market insights. Up to 30 companies working in the 3D sector will have the opportunity to exhibit their technologies at the 3D Summit exhibition.

SEMI will provide attendees networking opportunities throughout the event, including lunches, coffee breaks, a gala dinner and a complimentary one-on-one business meeting service. New this year: SEMI will offer attendees a chance to visit the Minatec Showroom, to learn about the latest innovations being developed in the Grenoble tech hub.

The  European 3D Summit steering committee includes executives from: ams AG, BESI, CEA-Leti, Evatech, EV Group, Fraunhofer-IZM, imec,  Scint-X,  SPTS, STMicroelectronics and SUSS Microtec.

Please visit www.semi.org/European3DSummit to register as an attendee or book a booth as an exhibitor.

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