Date: September 9, 2015 at 8:00 p.m. ET
Free to attend
Length: Approximately one hour
The proliferation of mobile devices and Internet of Things (IoT) will lead to unprecedented demands in terms of data-traffic. Data-sharing networks need to be capable of storing and transmitting large amount of data as well as perform smart data-analysis to enable timely planning and decision-making in both personal (e.g. social, health) and enterprise (e.g. business, factory, traffic management) settings. To handle rapidly increasing amount of data, microelectronic devices and the interconnects between the vast number of devices within smaller systems (e.g. wearables, mobile phones, implanted devices) and larger systems (cars, factory equipment, roads and bridges, supercomputers etc.) need to continuously scale with each successive generations. Moore’s law enables device scaling. Advanced interconnects and packaging technologies enable system-scaling and integration at the package level. In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.
Speaker:
Dr. Surya Bhattacharya, Director of Industry Development (IPP & TSV Programs), A*STAR Institute of Microelectronics (IME)
Dr. Surya Bhattacharya is Director of Industry Development for Interconnect & Packaging and Through-Silicon Via Programs for A*STAR Institute of Microelectronics (IME). Surya has over 20 years of experience ranging from 0.8micron to 28nanometer CMOS while working in the US semiconductor industry at both Fabless companies and Integrated Device Manufacturers (IDM). He joined IME from Qualcomm CDMA Technologies, San Diego, California, a world leader in semiconductor chips for 3G and LTE mobile phone markets. At Qualcomm, he served as Director of Foundry Engineering while he oversaw technology and manufacturing ramps across multiple foundries in Asia and around the world. Prior to Qualcomm, he was a Principal Foundry Engineer at Broadcom Corporation, Irvine, California, driving CMOS development and manufacturing for Broadcom’s networking and wireless products at Asian foundries. He started his career at Rockwell Semiconductor Systems, Newport Beach, California, where he was Senior Manager for CMOS technology development for Rockwell’s communication products.
Sponsored by Air Products
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