CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will demonstrate the first wireless sensor to combine leveling, vibration and Relative humidity (RH) measurement in an all-in-one device at SEMICON Taiwan in Taipei, September 2-4, 2015 in booth #426.

For semiconductor equipment diagnostics, qualification or preventative maintenance, the wireless, real-time, all-in-one WaferSense and ReticleSense Auto Multi Sensors (AMS) speed leveling, vibration and Relative Humidity (RH) measurement to help save time and expenses while increasing yields.

The WaferSense Auto Multi Sensor (AMS) can travel through virtually any tool with its thinner and lighter form factor and can also operate at higher temperatures for greater versatility. The ReticleSense Auto Multi Sensor (AMSR) incorporates the same combination of measurement capabilities in a reticle shaped form factor to travel anywhere a reticle travels. For these individual measurements in semiconductor fab processes, legacy methods are not real-time, can be complicated or inefficient, and can be costly when tools need to be taken off-line for various processes.

“Semiconductor fabs worldwide have relied on CyberOptics’ wireless, real-time measurement devices to improve yields and equipment uptime. Several Semiconductor OEM standards require the use of WaferSense and ReticleSense devices as the best known method (BKM) for various applications,” said Ferris Chen, Director of Sales, CyberOptics, Asia. “CyberOptics has combined two of proven measurement technologies, leveling and vibration, and added a new RH measurement capability into an all-in-one Auto Multi Sensor. This combination device provides equipment and process engineers even more convenience and saves even more time.”